Ivy Bridge (microarchitecture)

Ivy BridgeIvy Bridge-EIvy Bridge-EPIntel Ivy BridgeIvy Bridge microarchitecture3rd gen Core i3/i5/i73rd gen/Ivy BridgeCore i7 Ivy BridgeIntel Core i7 3770KIvy Bridge +
Ivy Bridge is the codename for the "third generation" of the Intel Core processors (Core i7, i5, i3).wikipedia
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LGA 2011

LGA 2011-v3LGA 2011-1LGA2011
Ivy Bridge-E family is the follow-up to Sandy Bridge-E, using the same CPU core as the Ivy Bridge processor, but in LGA 2011, LGA 1356 and LGA 2011-1 packages for workstations and servers. Both Core-i7 and Xeon versions are produced: the Xeon versions marketed as Xeon E5-1400 V2 act as drop-in replacements for the existing Sandy Bridge-EN based Xeon E5, Xeon E5-2600 V2 versions act as drop-in replacements for the existing Sandy Bridge-EP based Xeon E5, while Core-i7 versions designated i7-4820K, i7-4930K and i7-4960X were released on September 10, 2013, remaining compatible with the X79 and LGA 2011 hardware.
The LGA 2011 socket is used by Sandy Bridge-E/EP and Ivy Bridge-E/EP processors with the corresponding X79 (E – enthusiast class) and C600-series (EP – Xeon class) chipsets.

22 nanometer

22 nm20 nm22
Ivy Bridge is a die shrink to 22 nanometer manufacturing process based on the 32 nanometer Sandy Bridge ("second generation" of Intel Core) - see tick–tock model. The name is also applied more broadly to the 22 nm die shrink of the Sandy Bridge microarchitecture based on FinFET ("3D") Tri-Gate transistors, which is also used in the Xeon and Core i7 Ivy Bridge-EX (Ivytown), Ivy Bridge-EP and Ivy Bridge-E microprocessors released in 2013.
On May 2, 2011, Intel announced its first 22 nm microprocessor, codenamed Ivy Bridge, using a FinFET technology called 3-D Tri-Gate.

Thermal design power

TDPcTDPconfigurable TDP
A similar but more recent controversy has involved the power TDP measurements of some Ivy Bridge Y-series processors, with which Intel has introduced a new metric called scenario design power (SDP).

Intel X79

X79Patsburg
Both Core-i7 and Xeon versions are produced: the Xeon versions marketed as Xeon E5-1400 V2 act as drop-in replacements for the existing Sandy Bridge-EN based Xeon E5, Xeon E5-2600 V2 versions act as drop-in replacements for the existing Sandy Bridge-EP based Xeon E5, while Core-i7 versions designated i7-4820K, i7-4930K and i7-4960X were released on September 10, 2013, remaining compatible with the X79 and LGA 2011 hardware.
Socket and chipset support CPUs targeted at the high-end desktop (HEDT) and enthusiast segments of the Intel product lineup: Core i7-branded and Xeon-branded processors from the Sandy Bridge and Ivy Bridge CPU architectures.

Sandy Bridge

Intel Sandy BridgeSandy Bridge-EP2500K
Ivy Bridge is a die shrink to 22 nanometer manufacturing process based on the 32 nanometer Sandy Bridge ("second generation" of Intel Core) - see tick–tock model. Intel demonstrated the Haswell architecture in September 2011, which began release in 2013 as the successor to Sandy Bridge and Ivy Bridge.
Sandy Bridge is manufactured in the 32 nanometer process and has a soldered contact with the die and IHS (Integrated Heat Spreader), while Intel's subsequent generation Ivy Bridge (announced 2011) uses a 22 nanometer die shrink and a TIM (Thermal Interface Material) between the die and the IHS.

X86 virtualization

Intel VT-xAMD-VVT-x
and it became commercially available in the Ivy Bridge EP series of Intel CPUs, which is sold as Xeon E5-26xx v2 (launched in late 2013) and as Xeon E5-46xx v2 (launched in early 2014).

Haswell (microarchitecture)

HaswellHaswell-EHaswell microarchitecture
Intel demonstrated the Haswell architecture in September 2011, which began release in 2013 as the successor to Sandy Bridge and Ivy Bridge.
Haswell is the codename for a processor microarchitecture developed by Intel as the "fourth-generation core" successor to the Ivy Bridge (which is simply a die shrink/tick of Sandy-Bridge-microarchitecture).

LGA 1155

H2Ivy Bridge chipsetsLGA1155
LGA 1155, also called Socket H2, is a socket used for Intel microprocessors based on Sandy Bridge (2nd-Gen, 32nm, 2k-series) and Ivy Bridge (3rd-Gen, 22nm, 3k-series) microarchitectures.

Xeon

Intel XeonHarpertownWoodcrest
The name is also applied more broadly to the 22 nm die shrink of the Sandy Bridge microarchitecture based on FinFET ("3D") Tri-Gate transistors, which is also used in the Xeon and Core i7 Ivy Bridge-EX (Ivytown), Ivy Bridge-EP and Ivy Bridge-E microprocessors released in 2013.

Intel Graphics Technology

Intel HD GraphicsHD GraphicsIntel Insider
On 24 April 2012, Ivy Bridge was released, introducing the "third generation" of Intel's HD graphics:

FinFET

Tri-Gate3-dimensional transistors3–dimensional transistors
The name is also applied more broadly to the 22 nm die shrink of the Sandy Bridge microarchitecture based on FinFET ("3D") Tri-Gate transistors, which is also used in the Xeon and Core i7 Ivy Bridge-EX (Ivytown), Ivy Bridge-EP and Ivy Bridge-E microprocessors released in 2013.
Intel's "Tri-Gate" variant were announced at 22nm in 2011 for its Ivy Bridge microarchitecture.

SSE3

33rd-generation Streaming SIMD Extensions (SSE3)Prescott New Instructions

LGA 1356

Socket B2
Ivy Bridge-E family is the follow-up to Sandy Bridge-E, using the same CPU core as the Ivy Bridge processor, but in LGA 2011, LGA 1356 and LGA 2011-1 packages for workstations and servers.